I thought this was going to mean each stack was able to directly talk to the controller, since all stacks are resting on an interposer thing. But actually there is still a logic controller slice at the bottom of the stack, not at a right angle to the stack.
Instead of HBM microbumps between layers there is a more compact/dense TSV ("fusion bonded via-in-one") system. Intel once more showing their strong chiplet packing prowess! The claim is that thermals are still much better somehow, in spite of volumetric cell density increasing (from thinner layers). The demo has 8+1 dram+controller layers.
That slide is wrong, it's stacked the same way HBM is, the key difference is that they don't use microbumps anymore and instead have a hybrid bond system using copper to copper bonding. Copper is a good thermal conductor and the via is going through the entire wafer which in turn means that they are forming an uninterrupted copper cylinder that goes through all the layers. It's as if they put heat pipes inside the chip.
A search for patents by Stephen Morein who is listed as the CTO of SAIMEMORY shows
this one, assigned to Intel, and published strangely close to the press release;
Apologies, yeah, that slide seems inaccurate now. They also discuss magnetically coupled wireless interface to the host, lol, yeah, no.
The newer slides show a more conventionally stacked die arrangement. With yet a third way of connecting stacks, that at least visually looks different than via-in-one columns and more like tabs between the layers, and definitely not wireless. Hard to guess what to expect from this assorted material.
I thought this was going to mean each stack was able to directly talk to the controller, since all stacks are resting on an interposer thing. But actually there is still a logic controller slice at the bottom of the stack, not at a right angle to the stack.
Instead of HBM microbumps between layers there is a more compact/dense TSV ("fusion bonded via-in-one") system. Intel once more showing their strong chiplet packing prowess! The claim is that thermals are still much better somehow, in spite of volumetric cell density increasing (from thinner layers). The demo has 8+1 dram+controller layers.